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INTEGRATED CIRCUITS
DATA SHEET
74HC74; 74HCT74 Dual D-type flip-flop with set and reset; positive-edge trigger
Product specification Supersedes data of 1998 Feb 23 2003 Jul 10
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
FEATURES * Wide supply voltage range from 2.0 to 6.0 V * Symmetrical output impedance * High noise immunity * Low power dissipation * Balanced propagation delays * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V.
74HC74; 74HCT74
GENERAL DESCRIPTION The 74HC/HCT74 is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT74 are dual positive-edge triggered, D-type flip-flops with individual data (D) inputs, clock (CP) inputs, set (SD) and reset (RD) inputs; also complementary Q and Q outputs. The set and reset are asynchronous active LOW inputs and operate independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D inputs must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation. Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise and fall times.
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf = 6 ns TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay nCP to nQ, nQ nSD to nQ, nQ nRD to nQ, nQ fmax CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. For 74HC74 the condition is VI = GND to VCC. For 74HCT74 the condition is VI = GND to VCC - 1.5 V. maximum clock frequency input capacitance power dissipation capacitance per flip-flop notes 1 and 2 CONDITIONS HC CL = 15 pF; VCC = 5 V 14 15 16 76 3.5 24 15 18 18 59 3.5 29 ns ns ns MHz pF pF HCT UNIT
2003 Jul 10
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
FUNCTION TABLES Table 1 See note 1 INPUT SD L H L Table 2 See note 1 INPUT SD H H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; = LOW-to-HIGH CP transition; Qn+1 = state after the next LOW-to-HIGH CP transition. ORDERING INFORMATION PACKAGE TYPE NUMBER 74HC74N 74HCT74N 74HC74D 74HCT74D 74HC74DB 74HCT74DB 74HC74PW 74HCT74PW 74HC74BQ 74HCT74BQ TEMPERATURE RANGE -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C PINS 14 14 14 14 14 14 14 14 14 14 PACKAGE DIP14 DIP14 SO14 SO14 SSOP14 SSOP14 TSSOP14 TSSOP14 DHVQFN14 DHVQFN14 RD H H CP D L H RD H L L CP X X X D X X X
74HC74; 74HCT74
OUTPUT Q H L H Q L H H
OUTPUT Qn+1 L H Qn+1 H L
MATERIAL plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic
CODE SOT27-1 SOT27-1 SOT108-1 SOT108-1 SOT337-1 SOT337-1 SOT402-1 SOT402-1 SOT762-1 SOT762-1
2003 Jul 10
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SYMBOL 1RD 1D 1CP 1SD 1Q 1Q GND 2Q 2Q 2SD 2CP 2D 2RD VCC data input clock input (LOW-to-HIGH, edge-triggered) asynchronous set-direct input (active LOW) true flip-flop output complement flip-flop output ground (0 V) complement flip-flop output true flip-flop output asynchronous set-direct input (active LOW) clock input (LOW-to-HIGH, edge-triggered) data input asynchronous reset-direct input (active LOW) positive supply voltage DESCRIPTION asynchronous reset-direct input (active LOW)
74HC74; 74HCT74
handbook, halfpage handbook, halfpage
1RD 1
VCC 14 13 12 2RD 2D 2CP 2SD 2Q
1RD 1D 1CP 1SD 1Q 1Q GND
1 2 3 4 5 6 7
MNA417
14 VCC 13 2RD 12 2D
1D 1CP 1SD 1Q
2 3 4 5 6 7 Top view GND 8 2Q
74
11 2CP 10 2SD
GND(1)
11 10 9
9
2Q 1Q
8 2Q
MNB038
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig.1
Pin configuration DIP14, SO14 and (T)SSOP14.
Fig.2 Pin configuration DHVQFN14.
2003 Jul 10
4
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
handbook, halfpage
4 10 1SD 2SD 2 12 3 11 SD 1Q 1D Q D 2D 2Q 1CP CP 2CP FF 1Q Q 2Q RD 1RD 2RD 1 13
MNA418
handbook, halfpage
4 3 2
S C1 1D R
5
5 9
1
6
6 8
10 11 12 13
S C1 1D R
MNA419
9
8
Fig.3 Logic symbol.
Fig.4 IEC logic symbol.
handbook, halfpage
4
1SD SD D CP FF Q RD 1Q 6 Q
2 3
1D 1CP
1Q
5
1 10
1RD 2SD SD D CP FF Q RD 2Q 8 Q
12 11
2D 2CP
2Q
9
13
2RD
MNA420
Fig.5 Functional diagram.
2003 Jul 10
5
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
handbook, full pagewidth
Q C C
C C D C RD
C C Q C
SD
MNA421
CP
C C
Fig.6 Logic diagram (one flip-flop).
2003 Jul 10
6
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
RECOMMENDED OPERATING CONDITIONS 74HC74 SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CONDITIONS MIN. 2.0 0 0 -40 - - - TYP. 5.0 - - +25 - 6.0 - MAX. 6.0 VCC VCC +125 1000 500 400
74HC74; 74HCT74
74HCT74 UNIT MIN. 4.5 0 0 -40 - - - TYP. 5.0 - - +25 - 6.0 - MAX. 5.5 VCC VCC +125 500 500 500 V V V C ns ns ns
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC, IGND Tstg Ptot Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO14 packages: above 70 C derate linearly with 8 mW/K. For SSOP14 and TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 C derate linearly with 4.5 mW/K. For DIP14 packages: above 70 C derate linearly with 12 mW/K. PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation Tamb = -40 to +125 C; note 2 VI < -0.5 V or VI > VCC + 0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 CONDITIONS - - MIN. -0.5 MAX. +7.0 20 20 25 100 +150 500 V mA mA mA mA C mW UNIT
-0.5 V < VO < VCC + 0.5 V; note 1 - - -65 -
2003 Jul 10
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
DC CHARACTERISTICS Family 74HC At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C; note 1 VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL IO = -4.0 mA IO = -5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 4.0 mA IO = 5.2 mA ILI ICC input leakage current quiescent supply current VI = VCC or GND VI = VCC or GND; IO = 0 4.5 6.0 6.0 6.0 - - - - 4.5 6.0 3.84 5.34 1.5 3.15 4.2 - - - VCC (V) MIN.
74HC74; 74HCT74
TYP.
MAX.
UNIT
1.2 2.4 3.2 0.8 2.1 2.8 4.32 5.81 0.15 0.16 - -
- - - 0.5 1.35 1.8 - - 0.33 0.33 1.0 40
V V V V V V V V V V A A
Tamb = -40 to +125 C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL IO = -4.0 mA IO = -5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 4.0 mA IO = 5.2 mA ILI ICC Note 1. All typical values are measured at Tamb = 25 C. input leakage current quiescent supply current VI = VCC or GND VI = VCC or GND; IO = 0 4.5 6.0 6.0 6.0 - - - - - - - - 0.4 0.4 1.0 80 V V A A 4.5 6.0 3.7 5.2 - - - - V V 1.5 3.15 4.2 - - - - - - - - - - - - 0.5 1.35 1.8 V V V V V V
2003 Jul 10
8
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
Family 74HCT At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C; note 1 VIH VIL VOH VOL ILI ICC ICC HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage input leakage current quiescent supply current
additional quiescent supply current per input
74HC74; 74HCT74
MIN. VCC (V)
TYP.
MAX.
UNIT
4.5 to 5.5
2.0
1.6 1.2 4.32 0.15 - - 100
- 0.8 - - 1.0 40 450
V V V V A A A
4.5 to 5.5 - VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = 4.0 mA VI = VCC or GND VI = VCC or GND; IO = 0 VI = VCC -2.1 V other inputs at VCC or GND; IO = 0 4.5 4.5 5.5 5.5 3.84 0.33 - -
4.5 to 5.5 -
Tamb = -40 to +125 C VIH VIL VOH VOL ILI ICC ICC HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage input leakage current quiescent supply current
additional quiescent supply current per input
4.5 to 5.5
2.0
- - - - - - -
- 0.8 - 0.4 1.0 80 490
V V V V A A A
4.5 to 5.5 - VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = 4.0 mA VI = VCC or GND VI = VCC or GND; IO = 0 VI = VCC -2.1 V other inputs at VCC or GND; IO = 0 4.5 4.5 5.5 5.5 3.7 - - -
4.5 to 5.5 -
Note 1. All typical values are measured at Tamb = 25 C. Remark to HCT types The value of additional quiescent supply current (ICC) for a unit load of 1 is given here. To determine ICC per input, multiply this value by the unit load coefficient shown in the table. INPUT nD nRD nSD nCP UNIT LOAD COEFFICIENT 0.70 0.70 0.80 0.80
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
AC CHARACTERISTICS Family 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C tPHL/tPLH propagation delay nCP to nQ, nQ see Fig.7 2.0 4.5 6.0 propagation delay nSD to nQ, nQ see Fig.8 2.0 4.5 6.0 propagation delay nRD to nQ, nQ see Fig.8 2.0 4.5 6.0 tTHL/tTLH output transition time see Fig.7 2.0 4.5 6.0 tW clock pulse width HIGH or LOW see Fig.7 2.0 4.5 6.0 set or reset pulse width see Fig.8 LOW 2.0 4.5 6.0 trem removal time set or reset see Fig.8 2.0 4.5 6.0 tsu set-up time nD to nCP see Fig.7 2.0 4.5 6.0 th hold time nCP to nD see Fig.7 2.0 4.5 6.0 fmax maximum clock pulse frequency see Fig.7 2.0 4.5 6.0 - - - - - - - - - - - - 100 20 17 100 20 17 40 8 7 75 15 13 3 3 3 4.8 24 28 VCC (V) MIN.
74HC74; 74HCT74
TYP.
MAX.
UNIT
47 17 14 50 18 14 52 19 15 19 7 6 19 7 6 19 7 6 3 1 1 6 2 2 -6 -2 -2 23 69 82
220 44 37 250 50 43 250 50 43 95 19 16 - - - - - - - - - - - - - - - - - -
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz
2003 Jul 10
10
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +125 C tPHL/tPLH propagation delay nCP to nQ, nQ see Fig.7 2.0 4.5 6.0 propagation delay nSD to nQ, nQ see Fig.8 2.0 4.5 6.0 propagation delay nRD to nQ, nQ see Fig.8 2.0 4.5 6.0 tTHL/tTLH output transition time see Fig.7 2.0 4.5 6.0 tW clock pulse width HIGH see Fig.7 or LOW 2.0 4.5 6.0 tW set or reset pulse width see Fig.8 LOW 2.0 4.5 6.0 trem removal time set or reset see Fig.8 2.0 4.5 6.0 tsu set-up time nD to nCP see Fig.7 2.0 4.5 6.0 th hold time nCP to nD see Fig.7 2.0 4.5 6.0 fmax maximum clock pulse frequency see Fig.7 2.0 4.5 6.0 - - - - - - - - - - - - 120 24 20 120 24 20 45 9 8 90 18 15 3 3 3 4.0 20 24 VCC (V) MIN.
74HC74; 74HCT74
TYP.
MAX.
UNIT
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
265 53 45 300 60 51 300 60 51 110 22 19 - - - - - - - - - - - - - - - - - -
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz
2003 Jul 10
11
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
Family 74HCT GND = 0 V; tr = tf = 6 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C tPHL/tPLH propagation delay nCP to nQ, nQ propagation delay nSD to nQ, nQ propagation delay nRD to nQ, nQ tTHL/tTLH tW output transition time see Fig.7 see Fig.8 see Fig.8 see Fig.7 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 - - - - 23 20 8 15 +3 22 VCC (V) MIN.
74HC74; 74HCT74
TYP.
MAX.
UNIT
18 23 24 7 9 9 1 5 -3 54
44 50 50 19 - - - - - -
ns ns ns ns ns ns ns ns ns MHz
clock pulse width HIGH see Fig.7 or LOW set or reset pulse width see Fig.8 LOW
trem tsu th fmax
removal time set or reset set-up time nD to nCP hold time nCP to nD maximum clock pulse frequency
see Fig.8 see Fig.7 see Fig.7 see Fig.7
Tamb = -40 to +125 C tPHL/tPLH propagation delay nCP to nQ, nQ propagation delay nSD to nQ, nQ propagation delay nRD to nQ, nQ tTHL/tTLH tW output transition time see Fig.7 see Fig.8 see Fig.8 see Fig.7 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 4.5 - - - - 27 24 9 18 3 18 - - - - - - - - - - 53 60 60 22 - - - - - - ns ns ns ns ns ns ns ns ns MHz
clock pulse width HIGH see Fig.7 or LOW set or reset pulse width see Fig.8 LOW
trem tsu th fmax
removal time set or reset set-up time nD to nCP hold time nCP to nD maximum clock pulse frequency
see Fig.8 see Fig.7 see Fig.7 see Fig.7
2003 Jul 10
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
AC WAVEFORMS
74HC74; 74HCT74
handbook, full pagewidth
VI nD input GND th t su 1/fmax VI nCP input GND tW t PHL VOH nQ output VOL VOH nQ output VOL t PLH t PHL VM
MNA422
VM
th t su
VM
t PLH
VM
The shaded areas indicate when the input is permitted to change for predictable output performance. 74HC74: VM = 50%; VI = GND to VCC. 74HCT74: VM = 1.3 V; VI = GND to 3 V.
Fig.7
The clock (nCP) to output (nQ, nQ) propagation delays, the clock pulse width, the nD to nCP set-up, the nCP to nD hold times, the output transition times and the maximum clock pulse frequency.
2003 Jul 10
13
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
handbook, full pagewidth
VI nCP input GND t rem VI nSD input GND tW VI nRD input GND t PLH VOH nQ output VOL VOH nQ output VOL t PHL t PLH VM
MNA423
VM
VM
tW
VM
t PHL
VM
74HC74: VM = 50%; VI = GND to VCC. 74HCT74: VM = 1.3 V; VI = GND to 3 V.
Fig.8
The set (nSD) and reset (nRD) input to output (nQ, nQ) propagation delays, the set and reset pulse widths and the nRD, nRD to nCP removal time.
2003 Jul 10
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Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL
MNA183
RL = VO 1 k
VCC open GND
TEST tPZH tPZL tPHZ tPLZ VCC
S1 GND GND VCC
Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.9 Load circuitry for switching times.
2003 Jul 10
15
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
PACKAGE OUTLINES DIP14: plastic dual in-line package; 14 leads (300 mil)
74HC74; 74HCT74
SOT27-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 14 8 MH wM (e 1)
pin 1 index E
1
7
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 JEITA SC-501-14 EUROPEAN PROJECTION A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 99-12-27 03-02-13
2003 Jul 10
16
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2003 Jul 10
17
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A X
c y HE vM A
Z 14 8
Q A2 pin 1 index Lp L 1 bp 7 wM detail X A1 (A 3) A
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.4 0.9 8 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2003 Jul 10
18
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
2003 Jul 10
19
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
74HC74; 74HCT74
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 6 vMCAB wM C y1 C
C y
1 Eh 14
7 e 8
13 Dh 0
9 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.1 2.9 Dh 1.65 1.35 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT762-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
2003 Jul 10
20
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset; positive-edge trigger
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
74HC74; 74HCT74
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Jul 10
21
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp22
Date of release: 2003
Jul 10
Document order number:
9397 750 11259

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